Wire bonding is a technique used to create interconnections, or stud bumps in electronics. It is most commonly used to connect an integrated circuit (IC) or chip to a package, but can also be used to connect die to other components or even a Printed Circuit Board (PCB). It is the most widely used interconnect technology due to its flexibility and cost-effectiveness. There are three main types of wirebonding:
The advanced packaging facility is equipped with three wire bonding machines, a manual F&K Delvotec 5430, a semi-automatic TPT HB16 and a fully automated F&K Delvotec 6200 gold ball wire bonder. We have the capability to undertake wedge bonding, ball bonding and advanced wire bonding techniques such as stich bonding, security ball bonding and various loop shapes.

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Wire Bonding