Quality assessment of a packaging process is often subjective to the function and operating conditions of the electronics.
This ensures that the assessment produces an accurate reflection of the real life load on the packages.
The key rule of characterising packaging processes is to design tests which will produce the most failure modes of interest.
The assessment process also includes aging characterisation which deals with the quality of packaging after the individual process or complete packaging has gone through a number loading/unloading cycles.
This may include thermal, mechanical and pressure loads designed to replicate real life loading cycles.
A variety of methods can be used for characterising packaging processes such as microscopic inspection, surface profiling, dedicated mechanical tests, thermal testing and environmental testing.
These methods can be used individually or in combination to achieve a comprehensive assessment; the choice of methods depend on the failure modes of interest.
The characterisation tests may be carried out for each individual process or for the whole assembly after packaging. In addition to the assessment, using best practices to avoid known issues in the packaging processes also improves packaging quality.
The three main packaging processes, die attach, wire bonding and encapsulation have standard characterisation tests for quality assessment.
The advanced packaging facility has a range of testing and characterisation equipment. This includes Nordson DAGE 4000 bond tester, Alicona infinite focus non-contact surface profiler, Tencor P-11 contact profiler, Zeiss EVO scanning electron microscope and Wiess environmental chamber.
We aim to replicate the load stresses on a package in every quality assessment to ensure meaningful characterisation of the packaging process and directly relevant results to the operating conditions.
Contact us to discuss your applications and requirements.