About our team

We are a commercial research and development facility dedicated to providing microelectronic packaging services to the industry and research community. We have a broad range of dedicated packaging equipment and technical expertise to tackle advanced packaging requirements. We also offer quality characterisation services for the packaging processes, the characterisation data can be fed back to the packaging processes to improve the reliability of the electronics.

We are a team of experienced researchers who have a track record of successfully using their knowledge and technical expertise to provide packaging solutions. Our team members include:

Zeeshan is the tool lead for the dispenser and jetting systems. His activities revolve around epoxy and adhesive dispensing, thermal management of packaged devices and quality testing of packaging processes. He is the main interface to facilities for epoxy preparation and characterisation of individual packaging processes.
Chirenjeevi develops complete Chip On Board processes using the packaging facilities and is currently working on processes for quantum dot enhanced Light Emitting Diodes. He is the main interface to facilities for packaged device testing and characterisation using the many measurement facilities available within the University.
Tim is the tool lead for the wire bonding systems and has developed a number of unique programs for the wire bonders in the advanced packaging facility. He has a strong interest in efficient power management and hardware design. He is the main interface to electronic design automation (EDA) tools and downstream attachment of packaged devices into completed circuit designs using techniques such as through hole PCBs, surface mount and other techniques.

Contact us to discuss your applications or requirements. We have a dedicated packaging facility with a range of equipment to provide you comprehensive packaging services.

Electronic Packaging Team About Us