Advanced wire bonding techniques include security ball bonding, wire loop forming, and stitch bonding.
For additional reliability of the wire bond a security bond over the stitch or second bond of each ball bonded wire is added.
Some applications require different loop shapes to be formed as part of the wire bond process. To create the desired loop suitable Loop Parameters are adjusted to form different shapes which lead to different characteristics of the bond, for example increasing its stability. The different loop shapes are formed by creating a more complex program of steps in the path of the capillary, performing that path determines the final loop shape.
Some applications require several bond pad sites to be joined together.
Complex wire bond loops may be required to avoid contact between the wire bond, the die and the package or to create unique 3D stacking of die where overhanging die require unique wire loop pattern development.