Security Ball Bonding
Wire bond loop forming
Some applications require different loop shapes to be formed as part of the wire bond process. To create the desired loop suitable Loop Parameters are adjusted to form different shapes which lead to different characteristics of the bond, for example increasing its stability. The different loop shapes are formed by creating a more complex program of steps in the path of the capillary, performing that path determines the final loop shape.
Loop Forming Techniques
Double Reverse Loop
Some applications require several bond pad sites to be joined together.
Complex wire bond loops may be required to avoid contact between the wire bond, the die and the package or to create unique 3D stacking of die as in the example below where overhanging die require unique wire loop pattern development.
Contact us to discuss your applications or requirements. We have a dedicated packaging facility with a range of equipment to provide you comprehensive packaging services.