Underfill is the process of depositing an encapsulant in the gap between two dies or a die and the substrate to improve the reliability and durability of the flip chip assembly making both the physical contact and electrical interconnections more reliable
The underfill encapsulation provides the following benefits to a flip chip assembly.
The choice of encapsulant determines the characteristics of the underfill encapsulation which are tuned to the specific application requirements for the package.
At the Advanced Packaging Facility we can precisely and accurately deposit the underfill encapsulations for flip chip assembly. The facility has a robotic 3 axis jetting system with an integrated vision system which is ideally suited to the underfill applications.
At the facility we carefully consider the underfill requirements in terms of target applications of the flip chip assembly, the expected sources of failure and the required characteristics. The encapsulants are selected to match the specifications of the flip chip application. The jetting system allows us the flexibility to use either a one material underfill encapsulation or two material underfill encapsulation.