This web site is focused on Microelectronic Packaging.

Electronic packaging mainly consists of the following four processes.

Die bonding: An individual die is bonded to a package, board or another die. Wire bonding: Electrical interconnections are made between the die and the driver components. Encapsulation: The die and its electrical interconnections are protected from their environment by a physical barrier. Quality characterisation: The strength of die and wire bonds, the validity of encapsulation and the overall reliability of the packaged die is quantitatively and qualitatively analysed.

The video below illustrates a simple but typical packaging process.

Contact us to discuss your applications or requirements. We have a dedicated packaging facility with a range of equipment to provide you comprehensive packaging services.

Microelectronic Packaging Southampton UK