Wire Bonding
The gold ball bumping process creates conductive gold balls or stud bumps on the die bond pads. Gold stud bumping is a process used with die attach methods including flip chip bonding. The ball size depends on bonding wire size, the length of the tail (the wire used to make the ball) and the electronic flame off (EFO) power used to create the ball.
At the Advanced Packaging Facility we can create gold bumps on the die bond pads, with the bump's diameter down to 60μm(approx.), pad pitch at 100μm.
4236, Building 59, University of Southampton
Highfield Campus, Southampton
SO17 1BJ
Phone: 02380593234
Email: a.c.mallari@soton.ac.uk